TEC™ MSP 158
High performance hybrid adhesive for bonding of solid parquet flooring
TEC™MSP 158 is used for complete adhesion of all types of solid parquet floors including large-scales ones (strip widths up to 18 cm - plywood etc... Agglomerated cork-based insulated underlay. In particular, this enables the laying of solid parquet flooring in exotic woods, even in complicated environments (heated floors, bathrooms etc.).
TEC™MSP 158 provides strong adhesion, even without primer, on the majority of common building substrates such as : traditional cement screed, liquid cement or anhydrite-based screed, concrete floor, CTBX - CTBH plywood panels.
Use
- Interior floors
Flooring
- Solid parquet flooring
- Plywood parquet flooring
- Combined insulating underlay
Packaging
- 18 kg pail
Product Features
- Elastomer curing of adhesive film after setting
- Maintains good density
- Helps to improve the acoustic comfort of the parquet
- Easy to apply adhesive
- Safe for varnishes
- Suitable for application on low-temperature heated floors